SV Ob Cheeb Tsam 1: 1 hluav taws xob potting compound Sealant
Product Description
NTA
1. Tsawg viscosity, zoo fluidity, ceev npuas dissipation.
2. Zoo heev hluav taws xob rwb thaiv tsev thiab tshav kub conduction.
3. Nws tuaj yeem ua kom tob tob yam tsis muaj kev tsim cov tshuaj molecular tsawg thaum lub sijhawm kho, tsis tshua muaj shrinkage thiab zoo heev adhesion rau cov khoom.
Ntim
A: B = 1: 1
Qhov hnyav: 25 KG
Qhov hnyav B: 25 KG
YUAV TSUM siv
1. Potting thiab waterproof rau LED tsav tsheb, ballasts, thiab rov qab nres tsheb sensors.
2. Rwb thaiv tsev, thermal conduction, ya raws-pov thawj, thiab fixation functions rau lwm yam khoom siv hluav taws xob
TSEEM CEEB
Cov txiaj ntsig no tsis yog tsim los siv rau hauv kev npaj tshwj xeeb
QHOV TSEEB | A | B | |
Ua ntej Mixture | Qhov tshwm sim | Dawb | Dub |
(25 ℃, 65% RH) | viscosity | 2500 ± 500 | 2500 ± 500 |
Qhov ceev (25 ℃, g / cm³) | 1.6 ± 0.05 | 1.6 ± 0.05 | |
Tom qab Mixtured | Qhov ratio (los ntawm qhov hnyav) | 1 | 1 |
(25 ℃, 65% RH) | Xim | Grey | |
viscosity | 2500-3500 | ||
Lub sijhawm ua haujlwm (min) | 40 ~ 60 | ||
Lub sij hawm kho (H, 25 ℃) | 3 ~ 4 | ||
Lub sij hawm kho (H, 80 ℃) | 10 ~ 15 | ||
Tom qab Curing | Hardness (Shore A) | 55 ± 5 | |
(25 ℃, 65% RH) | Tensile zog (Mpa) | ≥1.0 | |
Thermal conductivity (W / m·k) | ≥0.6 ~ 0.8 | ||
Dielectric zog (KV / mm) | ≥14 | ||
Dielectric qhov tsis tu ncua (1.2MHz) | 2.8 ~ 3.3 hli | ||
Volume Resistivity (Ω·cm) | ≥1.0 × 1015 | ||
Coefficient ntawm Linear Expansion (m / m·k) | ≤ 2.2 × 10-4 | ||
Ua haujlwm kub (℃) | -40 ~ 100 |
Sau koj cov lus ntawm no thiab xa tuaj rau peb